DISPERBYK® is a wetting and dispersing additive for solvent-borne systems . It is composed of a solution of a copolymer with acidic groups. This prod. Solution of a copolymer with acidic groups. Acts as a wetting and dispersing additive for aqueous and solvent-borne systems. Provides deflocculation through . Material Safety Data Sheet. DISPERBYK Version Revision Date 08/14/ Print Date 08/14/ 1 / SECTION 1. PRODUCT AND COMPANY.

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After de-agglomeration, dispersion stability may be maintained by achieving a balance between attractive and repulsive forces in an ink formulation. Printed conductive films have the potential to lower manufacturing costs for microelectronics and large area electronics.

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Copper, with a resistivity of 1. In contrast; at high pH, protons may be removed to produce a negatively charged surface. Tin-silver alloy electroplating bath and tin-silver alloy electroplating dsperbyk.

The method of making the metal mesh conductive film, the metal mesh conductive film of the touch panel. Tin electrodeposits having properties or characteristics that minimize tin whisker growth. The photosintering dsiperbyk may occur on a time scale from microseconds to less than a millisecond. Alloy-plated sheet steel cured with a thin layer of insulating disperbjk material forming an electrically nonconductive breachable metal substrate.

Composition and method for improving adherence of copper foil to 1110 substrates. Electronic components, electronic component manufacturing method and circuit board. Ink for ink jet printing and method for preparing metal nanoparticles used therein. The curing process may be carried out at room temperature in air. Thus, residual conductive polymer may not increase the resistivity as much as insulating residues from non-conducting dispersants.

A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a sintering additive.

Method for reflowing a metal plating layer of a contact and contact formed thereby. Method of laser bonding for gold, gold coated and gold alloy coated electrical members. These mechanical processes may be carried out in the presence of a dispersant to reduce the occurrence of re-agglomeration after mechanical agitation. A mixture of water and alcohol was used as a vehicle for formulating copper inks. Contact permission We’d love to send you exclusive offers and the latest info relating to health and safety and safety data sheets by email and other electronic means.


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The film may be substantially free of imperfections, such as pin holes. The printed and dried inks may be cured. MSDS includes information such as melting point, boiling point, and flash point of a hazardous material.

The solvent may include water, an organic solvent, or any combination thereof. Any residues from these dispersants remaining in the cured metallic films will result in higher resistivities being obtained in the metal conductor that is formed because these dispersants and their decomposition products are non-conducting organic compounds, or insulators.

Copper particulate dispersion, conductive film forming method and circuit board. Aerosol jet printable metal conductive inks, glass coated metal conductive inks and dizperbyk dielectric inks and methods of preparing and printing the same. Metal nanoparticles may be added to the conductive polymer dispersion to form a metal nanoparticle dispersion.

Epitaxial growth of aligned algainn nanowires by metal-organic chemical vapor deposition. These salt bridges may be dissolved by a dispersant to break up the agglomerates. However, those of skill in the art should, in light of the present disclosure, visperbyk that many changes may be made in the specific embodiments that are disclosed and still obtain a like or similar result without departing from the spirit and scope of the invention.

A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a thermally cleavable agent.

Sample Report for Indian Import Data of Disperbyk 110

In an example, high-purity copper films with a resistivity of about 2. Photonic sintering of a solderable polymer thick film copper conductor composition. In some implementations, the polymeric dispersant may be ionic, non-ionic, or any combination of ionic and non-ionic polymeric dispersants.


The printed metal inks, after the pre-cure drying step, may be black and therefore able to absorb light over a broad range of wavelengths. The melted nanoparticles may fuse together. Electrical circuit component disperbbyk of a conductive liquid printed directly onto a substrate. In addition to the thermodynamic advantage that is gained by having multiple attachment points between the nanoparticle and the head group of a conductive polymer, there is also an advantage in the conducting polymer having a tail group to it.

With both anionic and cationic groups present in the dispersant, the dispersant is compatible with the different charge regions on the metal nanoparticles, and a stable dispersion may be achieved. Some or all of these steps are described in detail in the examples below.

DISPERBYK MSDS Download Health & Safety Software | Sevron

If the conductive polymer is also the dispersant for metallic nanoparticles, the resistivity of the resulting metallic films may be significantly reduced, due at least in part to limited visperbyk no additional contamination from residual non-conducting dispersants.

These differences may result from different surface energies of substrates, different adhesion properties of substrates, requirements of different printing methods such as ink-jetting, and different strategies used to sinter the metallic inks into metal conductors.

The content of such third party sites is not within our control, and we cannot and will not take responsibility for the information or content. Nickel-containing and corrosive printable paste, as well as methods of forming electrical contacts in the manufacture of a solar cell.

The ink of claim 1further comprising a surface tension modifier. This space is substantially free from other nanoparticles.

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